Composite and Material molding Solution
Sekisui Polymatech material molding solutions enable the flexible processing of polymer materials to provide high-performance molded products for the electronics, automotive, telecommunications, and semiconductor industries.
We offer a diverse range of products, including DOT connectors utilizing magnetic field alignment technology, ultra-multipole DOT sheets for narrow pitch applications, and automotive touch panel sensors.
We also possess proprietary resins for vibration damping and waterproofing applications, along with molding technology for 3D shapes, enabling stable quality and mass production through automated molding.
We contribute to solving design challenges and maximizing product value.
Wearable Products
As the wearable device market expands, Sekisui Polymatech offers ultra-low-resistance heat-sealed rubber connectors utilizing particle alignment technology.
These connectors allow for flexible design and are ideal for providing waterproofing. Since they require no heat processing and have low hardness, they reduce stress on precision components such as ICs and help streamline manufacturing processes.
Portable Electronic Devices
Sekisui Polymatech are solderless crimp connectors that are ideal for portable electronic devices.
Since they can be connected without applying heat, they reduce stress on precision components and help improve product reliability. These molded products also offer a high degree of design flexibility and are compatible with the “right to repair” movement, which has gained attention in recent years.
IC and Substrate coneection
Sekisui Polymatech ultra-multipole DOT sheet enables stable connections even at narrow pitches because its anisotropic conductivity allows current to flow only in the longitudinal direction. It eliminates the need for probe pins, simplifying alignment, and its low-hardness rubber-based design prevents PCB warping and scratches. It enhances connection reliability for ICs and high-density PCBs while also helping to reduce process workload.