Silicone Free Thermal conductive Grease GA Series
Single-component non-curing, heat-dissipating grease. Can be used in very thin gaps, achieving low thermal resistance.
Does not contain low-molecular cyclic siloxane, which can cause contact failures.
Description.
Features1.
Title of the block
Compared to thermal pads, it can be thinned to a very low layer and achieves extremely low thermal resistance.
Features2.
Title of the block
It offers excellent handling properties, making it easy to dispense and apply onto substrates.
Features3.
Title of the block
Since silicone oil is not used, there are no issues related to low-molecular cyclic siloxane, such as contact failures.
SHEET
Various Characteristics
| characteristic item | unit | GA200 | GA204 | GA401 | GA690 |
|---|---|---|---|---|---|
| Thermal conductivity *1 | W/(m-K) | 2.0 | 2.4 | 4.1 | 4.5 |
| appearance | - | white | white | gray (SI unit of absorbed dose of radiation) | gray (SI unit of absorbed dose of radiation) |
| binder | - | Ester oil | Ester oil | Ester oil | Ester oil |
| viscosity | Pa-s | 170 | 110 | 350 | 300 |
| specific gravity | - | 3.1 | 3.2 | 2.55 | 2.55 |
| Minimum film thickness | μm | 20 | 20 | 25 | 25 |
| solvent | - | nil | nil | nil | contain |
| Operating temperature range | C | -40 ~ 150 | -40 ~ 150 | -40 ~ 150 | -40 ~ 150 |
| delivery mode | - | Can or Syringe | Can or Syringe | Can or Syringe | can |
1 Hot wire method
*Syringe: 30cc or 70cc, Can: 1/2L Can
Please contact us for the content quantity.
Line-up
Product Lineup
Heat Dissipation Product Lineup
Products
Product Introduction
GA200
Can be compressed up to 20um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.
GA204
Can be compressed up to 20um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.
GA401
Can be compressed up to 25um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.
GA690
Can be compressed up to 25um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.
