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Silicone Free Thermal conductive Grease GA Series

Single-component non-curing, heat-dissipating grease. Can be used in very thin gaps, achieving low thermal resistance.
Does not contain low-molecular cyclic siloxane, which can cause contact failures.

By Issue : By Industry : Product ID:  24815

Description.

Features1.

Title of the block

Compared to thermal pads, it can be thinned to a very low layer and achieves extremely low thermal resistance.

Features2.

Title of the block

It offers excellent handling properties, making it easy to dispense and apply onto substrates.

Features3.

Title of the block

Since silicone oil is not used, there are no issues related to low-molecular cyclic siloxane, such as contact failures.

GREASE

Various Characteristics

characteristic item unit GA200 GA204 GA401 GA690
Thermal conductivity *1 W/(m-K) 2.0 2.4 4.1 4.5
appearance - white white gray (SI unit of absorbed dose of radiation) gray (SI unit of absorbed dose of radiation)
binder - Ester oil Ester oil Ester oil Ester oil
viscosity Pa-s 170 110 350 300
specific gravity - 3.1 3.2 2.55 2.55
Minimum film thickness μm 20 20 25 25
solvent - nil nil nil contain
Operating temperature range C -40 ~ 150 -40 ~ 150 -40 ~ 150 -40 ~ 150
delivery mode - Can or Syringe Can or Syringe Can or Syringe can
Purchase site:
Monotaro (for customers in Japan)
- Purchase Link Purchase Link Purchase Link -

*1 Heat-line method
※Syringe: 30cc or 70cc; Can: 1/2L can
Please contact us for information regarding product volume.
※The "Purchase" button on this page will redirect you to the Japanese domestic shopping site (Monotaro).
Purchases may not be available for users accessing this site from overseas. If you wish to purchase from outside Japan, please contact us via the product inquiry page.

Line-up

Product Lineup

Heat Dissipation Product Lineup

Products

Product Introduction

GA200

Thermal conductivity 2W/(m-K)
Can be compressed up to 20um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.

GA204

Thermal conductivity 2.4W/(m-K)
Can be compressed up to 20um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.

GA401

Thermal conductivity 4.1W/(m-K)
Can be compressed up to 25um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.

GA690

Thermal conductivity 4.5W/(m-K)
Can be compressed up to 25um to achieve low thermal resistance.
Excellent application workability.
Solvent-free product.

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